GR5515IGND

汇顶科技
0.00
RMB

Overview

支持蓝牙5.1的高性能蓝牙系统级芯片（SoC）

Features

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Features

BR / EDR / LE

Block Diagram

Application Note

可广泛应用于移动设备、可穿戴产品和物联网（IoT）产品等。本系列芯片能够帮助用户开发具有中心角色和/或外围角色的低功耗蓝牙应用产品。

Development Board

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Core Type

Cortex®-M4F

CPU Clock Speed

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CPU Architecture

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CPU Features

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Bluetooth Version

5.1

Operating Frequency [Max] (MHz)

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Flash (kB)

1M

Cache

-

SRAM (kB)

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EEPROM (kB)

__

Debugging

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Upgrade Type

Manual

Crystal

no

on chip (PLL)

no

crystal (optional)

no

on-chip RC

no

External clock

no

Timers [Number, bits]

no

Real-Time Clock

no

Watchdog timer

no

GPIO

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Pins

__

Pitch

__

Channels

__

ADC [Number, bits]

__

True Random Number Generator

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Analog comp

no

low-power comp

no

Temperature sensor

no

NFC Tag

__

SPI

__

DAC [Number, bits]

__

UART

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SSI

__

PWM [Number, bits]

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I2C

-

TWI

no

QDEC

-

PDM

-

USB

no

SPI

no

Quad SPI

-

I2S

no

Debug interface

-

Human Machine Interface

-

Programmable channels

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Fixed channels

__

Channel groups

__

Supply Voltage [Min to Max] (V)

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no

On-chip VBUS

no

Regulated supply for external components

-

Power fail

no

Crypto Accelerator

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Public Key Hardware Accelerator

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Accelerator

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Security

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__

Current

__

Sensor Controller

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Standby

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Transceiver Compatible

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Receiver Sensitivity

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Output Power

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Frequency Regulation

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Protocols

-

Bluetooth 5 PHYs

-

bluetooth 5.1 support

-

Dimension

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Package Type

QFN56

DSP RAM

__

DSP Clock Speed

__

DSP Clock Speed

__

Voice Services

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General

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